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18v 30ma RGB LED Chip Red For Exhibition Light

Basic Information
Place of Origin: SUZHOU
Brand Name: PHOENIX
Certification: LM80 CE ROHS
Model Number: 2835
Minimum Order Quantity: 4000PCS
Price: Negotiation
Packaging Details: 4000PCS /ROLL
Delivery Time: 7-10 DAYS
Payment Terms: Western Union, MoneyGram, T/T
Supply Ability: 800KK PER MONTH
Name: SMD LED 2835 Green Color Application: Logo ,sign ,light Boxes,exhibition Light
Nput Voltage(V): 18v Luminous Flux(lm): 29lm-32lm
Power: 30ma Wld(nm): 445-455nm
Warranty(Year): 2 Years Working Time (hours): 20000
Operating Temperature(℃): -40-85 Viewing Angle(°):: 120
Color Rendering Index(Ra):: 70 80 Material:: Copper Base+gold Wire
High Light:

30ma RGB LED Chip

,

18v RGB LED Chip

,

Red 18v led chip

Application Introduction:

 

1. The LED light box adopts ultra-thin design;

 

2. Using high-quality LED light source, the lamp box is long-term, reliable and durable, long service life and extremely low maintenance cost;

 

3. Diversified design, flexible flashing mode, more advertising effect;

 

4. Low voltage DC power supply, power saving, safety, aluminum alloy frame, safety and environmental protection.

 

18v 30ma smd led chip rgb red for exhibition light sign light

 

Quick details:

 

Input Voltage(V): 18-20V
Warranty(Year): 2-Year
Type: Smd Led Chip 2835
Lighting solutions service: Lighting and circuitry design
Luminous Efficacy(lm/w): 29-32lm
Lifespan (hours): 50000
Working Time (hours): 20000
Chip Material: INGAN
Emitting Color: Red green blue
Power: 0.2W
Viewing Angle(°): 120 Degree
Color Rendering Index(Ra): 80
Packing bag: 220*240nm
Place of Origin: Suzhou ,jiangsu
Application: Exhibition ,sign lights 
Package Type: Suface Mount Package
Forward Current: 30MA
Size: 2.8*3.5*0.65mm
Packing: 4000 Pcs/Roll


Product specification:

 

Outline Dimension:

18v 30ma RGB LED Chip Red For Exhibition Light 0

Absolute Maximum Ratings:

 

Item Symbol Maximum Unit
Power dissipation PD 1 W
Continuous forward current IFmax 60 mA
Peak forward current (1/10 duty cycle 10ms pulse width) IFP 80 mA
Reverse voltage VR 5 V
Electrostatic Discharge (HBM) ESD 2000 V
Operating temperature range Topr -40 to +85
Storage temperature range Tstg -40 to +85
Led yunction temperature Tj 125

 

Electrical/Optical Characteristics:

 

Item Symbol Condition Color Min Typ Max Unit

 

Forward voltage

 

VF

 

IF=60mA

R 17.5 18.5 19 V
G 17.5 18.5 19 V
B 17.5 18.5 19 V
Viewing Angle 2θ1/2 IF=60mA R/G/B - 120 - Deg

 

Luminous Intensity

 

IV

I

IF=60mA

 

R   -   LM
G   -   LM
B   -   LM

 

 

Wavelength

 

 

WLD

IF=60mA R 615 - 620 nm
G 515 - 520 nm
B 452 - 457.5 nm
Reverse Current Ir Vr=7V R/G/B 0   1 uA
Thermal resistance Rth(j-s) IF=60mA R/G/B   28   ℃/W

 

Typical Electro-Optical Characteristic Curves:

18v 30ma RGB LED Chip Red For Exhibition Light 1

Reliability Test Items And Conditions:

 

No. Item Test Conditions

Test

hr/cycle/time

Sample

Q’ty

Ac∕Re
1 Solder Heat TEMP:260℃±5℃;5±1 sec 2 times 30 pcs 0∕1
2 Solder ability Test ※ TEMP:235℃±5℃;3±1 sec 1 time 5 pcs 0∕1
3 Temperature Cycle

H:+100℃ 30min.

∫5min.

L:-40℃ 30min.

100 cycles 20 pcs 0∕1
4 Thermal Shock

H:+100℃ 5min.

L:-40℃ 5min.

50 cycles 20 pcs 0∕1
5 High Temperature Storage TEMP:100℃ 1000 hrs 20 pcs 0∕1
6 Low Temperature Storage TEMP:-40℃ 1000 hrs 20 pcs 0∕1
7 DC Operating Life IF=IFmax 1000 hrs 20 pcs 0∕1
8

High Temperature

High Humidity

85℃∕85%R.H. 1000 hrs 20 pcs 0∕1
9 Shocking test

100~2000Hz ;98.1m/s2

X,Y,Z direction

2 hrs 20 pcs 0∕1
10 Dropping test Put on pallet ;height:75cm 3 times 20 pcs 0∕1
Judgment Criteria
Forward Voltage VF VF Max-Increase < 1.1x
Reverse Current IR IR Max-Increase < IRmax
Luminous Intensity IV IV Decay < 40%

※Solder ability test criteria:coverage is not less than 95%

Note:Measurement shall be taken after the tested samples have been returned to normal ambient conditions (generally after two hours)

 

Packing and Shipping Instruction:

18v 30ma RGB LED Chip Red For Exhibition Light 2

Cautions:
The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the
Top of package. The pressure to the top surface will be influence to the reliability of the LEDs. Precautions Should be taken to avoid the strong pressure on the encapsulated part. So when use the picking up nozzle,The pressure on the silicone resin should be proper.

Soldering iron :
When hand soldering, the temperature of the iron must less than 300℃ for 3 seconds
The hand solder should be done only one times

SMT Reflow Soldering Instructions SMT :
Reflow soldering should not be done more than two times
When soldering , do not put stress on the LEDs during heating
The recommended reflow soldering profile as following

 

18v 30ma RGB LED Chip Red For Exhibition Light 3

 

 

 

 

 

Product features:

 

Adopt good quality chip and frame ,antistatic good stability Ultra low attenuation

High brightness ,low attenuation high color rendering

Minimum 70,80,90 95 CRI options

Strong welding and good stability undead light

Product series and company logo on the front

CE ROHS LM80 Certification

 

Production Process:

 

18v 30ma RGB LED Chip Red For Exhibition Light 4

 

 

 

 

 

 

Contact Details
Mini

Phone Number : +8618897990409

WhatsApp : +8618897990409