Name: | SMD LED 2835 Green Color | Application: | Logo ,sign ,light Boxes,exhibition Light |
---|---|---|---|
Nput Voltage(V): | 18v | Power: | 30ma |
Luminous Flux(lm): | 29lm-32lm | Wld(nm): | 445-455nm |
Warranty(Year): | 2 Years | Working Time (hours): | 20000 |
Operating Temperature(℃): | -40-85 | Viewing Angle(°):: | 120 |
High Light: | 30ma rgbw led chip,18v rgbw led chip,30ma Rgbw high power led package |
Application Introduction:
Side light guide design, uniform light; Transparent crystal frame: when the light box is lit, the surrounding of the frame is brilliant, and the imported optical acrylic material has a beautiful appearance; Ultra thin: the thickness is only 8mm-10mm; LED light source: safer, energy-saving, longer service life, easy to replace pictures; Convenient installation: there are many ways to place on the table and wall; Applicable to: hotel bar, fast food restaurant, chain store, wedding photo studio, interior decoration, company signboard, gift display, window display, exhibit display and other places
High voltage 18v 30ma smd led chip rgb red green blue pink for exhibition light sign light
Quick details:
Input Voltage(V): | 18-20V |
Warranty(Year): | 2-Year |
Type: | Smd Led Chip 2835 |
Lighting solutions service: | Lighting and circuitry design |
Luminous Efficacy(lm/w): | 29-32lm |
Lifespan (hours): | 50000 |
Working Time (hours): | 20000 |
Chip Material: | INGAN |
Emitting Color: | Red green blue |
Power: | 0.2W |
Viewing Angle(°): | 120 Degree |
Color Rendering Index(Ra): | 80 |
Packing bag: | 220*240nm |
Place of Origin: | Suzhou ,jiangsu |
Application: | Exhibition ,sign lights |
Package Type: | Suface Mount Package |
Forward Current: | 30MA |
Size: | 2.8*3.5*0.65mm |
Packing: | 4000 Pcs/Roll |
Product specification:
Outline Dimension:
Absolute Maximum Ratings:
Item | Symbol | Maximum | Unit |
Power dissipation | PD | 1 | W |
Continuous forward current | IFmax | 60 | mA |
Peak forward current (1/10 duty cycle 10ms pulse width) | IFP | 80 | mA |
Reverse voltage | VR | 5 | V |
Electrostatic Discharge (HBM) | ESD | 2000 | V |
Operating temperature range | Topr | -40 to +85 | ℃ |
Storage temperature range | Tstg | -40 to +85 | ℃ |
Led yunction temperature | Tj | 125 | ℃ |
Electrical/Optical Characteristics:
Item | Symbol | Condition | Color | Min | Typ | Max | Unit |
Forward voltage |
VF |
IF=60mA |
R | 17.5 | 18.5 | 19 | V |
G | 17.5 | 18.5 | 19 | V | |||
B | 17.5 | 18.5 | 19 | V | |||
Viewing Angle | 2θ1/2 | IF=60mA | R/G/B | - | 120 | - | Deg |
Luminous Intensity |
IV |
I IF=60mA
|
R | - | LM | ||
G | - | LM | |||||
B | - | LM | |||||
Wavelength |
WLD |
IF=60mA | R | 615 | - | 620 | nm |
G | 515 | - | 520 | nm | |||
B | 452 | - | 457.5 | nm | |||
Reverse Current | Ir | Vr=7V | R/G/B | 0 | 1 | uA | |
Thermal resistance | Rth(j-s) | IF=60mA | R/G/B | 28 | ℃/W |
Typical Electro-Optical Characteristic Curves:
Reliability Test Items And Conditions:
No. | Item | Test Conditions |
Test hr/cycle/time |
Sample Q’ty |
Ac∕Re | |
1 | Solder Heat | TEMP:260℃±5℃;5±1 sec | 2 times | 30 pcs | 0∕1 | |
2 | Solder ability Test ※ | TEMP:235℃±5℃;3±1 sec | 1 time | 5 pcs | 0∕1 | |
3 | Temperature Cycle |
H:+100℃ 30min. ∫5min. L:-40℃ 30min. |
100 cycles | 20 pcs | 0∕1 | |
4 | Thermal Shock |
H:+100℃ 5min. ∫ L:-40℃ 5min. |
50 cycles | 20 pcs | 0∕1 | |
5 | High Temperature Storage | TEMP:100℃ | 1000 hrs | 20 pcs | 0∕1 | |
6 | Low Temperature Storage | TEMP:-40℃ | 1000 hrs | 20 pcs | 0∕1 | |
7 | DC Operating Life | IF=IFmax | 1000 hrs | 20 pcs | 0∕1 | |
8 |
High Temperature High Humidity |
85℃∕85%R.H. | 1000 hrs | 20 pcs | 0∕1 | |
9 | Shocking test |
100~2000Hz ;98.1m/s2 X,Y,Z direction |
2 hrs | 20 pcs | 0∕1 | |
10 | Dropping test | Put on pallet ;height:75cm | 3 times | 20 pcs | 0∕1 | |
Judgment Criteria | ||||||
Forward Voltage VF | VF Max-Increase < 1.1x | |||||
Reverse Current IR | IR Max-Increase < IRmax | |||||
Luminous Intensity IV | IV Decay < 40% | |||||
※Solder ability test criteria:coverage is not less than 95% Note:Measurement shall be taken after the tested samples have been returned to normal ambient conditions (generally after two hours) |
Packing and Shipping Instruction:
Cautions:
The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the
Top of package. The pressure to the top surface will be influence to the reliability of the LEDs. Precautions Should be taken to avoid the strong pressure on the encapsulated part. So when use the picking up nozzle,The pressure on the silicone resin should be proper.
Soldering iron :
When hand soldering, the temperature of the iron must less than 300℃ for 3 seconds
The hand solder should be done only one times
SMT Reflow Soldering Instructions SMT :
Reflow soldering should not be done more than two times
When soldering , do not put stress on the LEDs during heating
The recommended reflow soldering profile as following
Product features:
Adopt good quality chip and frame ,antistatic good stability Ultra low attenuation
High brightness ,low attenuation high color rendering
Minimum 70,80,90 95 CRI options
Strong welding and good stability undead light
Product series and company logo on the front
CE ROHS LM80 Certification
Production Process: