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3V 2016 20-30LM AC Led Chip Led Smd Bead Chips Bulb Light

Basic Information
Place of Origin: SUZHOU
Brand Name: PHOENIX
Model Number: 2016
Minimum Order Quantity: 4000PCS
Price: Negotiation
Packaging Details: 4000PCS /ROLL
Delivery Time: 7-10 DAYS
Payment Terms: Western Union, MoneyGram, T/T
Supply Ability: 400KK PER MONTH
Name: SMD LED 2016 White Color Nput Voltage(V): 3v
Cct: 2700K 3000K 6000K Power: 0.2W
Luminous Flux(lm): 20-30lm Warranty(Year): 2 Years
Working Time (hours): 20000 Color Rendering Index(Ra): 80
Operating Temperature(℃): -40-85 Lamp Luminous Efficiency(lm/w): 130
High Light:

2016 ac led chip


Smd ac led chip


led smd bead chips bulb light


Exterior decoration: daytime running light, fog light, turn signal light, rear combination light, license plate lighting, body lighting (such as grille and logo)
Interior: map and interior dome lighting
Portable lamp
Display backlight
Indoor, outdoor and architectural lighting
Decorative and entertainment lighting
Advertising lighting
Signal lamp

Viewing angle:120 deg

Ø The materials of the LED dice is InGaN

Ø 2.2mm*1.6mm*0.6mm

Ø RoHS compliant lead-free soldering compatible


2.Package Structure:

3V 2016 20-30LM AC Led Chip Led Smd Bead Chips Bulb Light 0

                                                                             Unit: mm Tolerance: +/-0.2mm



Figure: 0.2W medium power thin series circuit diagram

Tolerance: ±0.2mm unless otherwise noted

Electrodes: Ag Plating Copper Alloy

Encapsulating Resin: Silicon Resin

Package: Heat-Resistant Polymer


 3.Electro-Optical Characteristics:                                                       (Each LED @ 60mA, Ta 25℃ )

Product No. Material VF(V) Color RA Flux(lm)
min max CIE coordinates x, y min max
QT-2016ZW-1CSAZ InGaN 2.8 3.5 Typ x=0.33, y=0.33 80 85 28


4.Product Specification:


Item Specification Material Quantity
Chip InGaN InGaN 1 in 1
Reflector White PPA  
Frame C2680 Silver-Plated Copper  
Gold wire 0.9mil Alloy  
Phosphor Yellow YAG  
Encapsulant MilkyWhite Resin  
Carrier tape According to EIA 481-1A specs Conductive black tape 4000pcs per reel
Reel According to EIA 481-1A specs Conductive black 4000pcs per reel
Label Repsn standard Paper  
Packing bag 220x240mm Aluminum laminated bag/ no-zipper One reel one bag
Carton Repsn standard Paper Non-specified


5.Absolute Maximum Ratings:


Item Symbol Absolute Maximum Ratings Unit
Forward Current IF 60 mA
Reverse Voltage Vr 5 V
Pulsed Forward Current IFP* 90 mA
Power dissipation PD 0.2 W
Operating Temperature TOP -40~85
Storage Temperature TST -40~85
Electrostatic Discharge ESD 2000(HBM) V
Junction Temperature Tj 110
LED Thermal resistance Rth s-j 27 ℃/W


6.Typical Electro-Optical characteristics curves:

3V 2016 20-30LM AC Led Chip Led Smd Bead Chips Bulb Light 1


7.LED Reliability Test List:


Test Item Test Conditions Standard Qty(Pcs)
Life Test 25℃,1000Hrs@60mA / 22
High Temperature 85℃,1000Hrs@60mA / 22
Low Temperature -40℃,1000Hrs@60mA / 22
High Humidity Heat



/ 22
Low Temperature Storage -40℃,1000Hrs


200 202

High Temperature Storage 100℃,1000Hrs


200 201

Temperature Cycle (-40'C 30mins --25'C(5mins)--100'C(30mins) ,Temp changing rate:3+/-0.6'C/min)


100 105

Thermal Shock -40'C(15mins) --100'C(15mins),changing time <5mins ,300C MIL-STD-202G 22
Pulse Life Test Tp=1ms,DC=0.1,D=Tp/T @ 3×60mA,1000Hrs / 22
ESD Test(HBM) 2000V,200V/Step, Forward & Reverse Test both 3times



Soldering Resistance


Pre-treatment 30℃,70%RH


300 302

Reflow IV Decay


Pre-treatment 30℃,70%RH,168Hrs

/ 22
Judgment Criteria
Forward Voltage VF VF Max-Increase < 1.1x
Reverse Current IR IR Max-Increase < IRmax
Luminous Intensity IV IV Decay < 40%
※Solder ability test criteria:coverage is not less than 95%
Note:Measurement shall be taken after the tested samples have been returned to normal ambient conditions (generally after two hours)



The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the

Top of package. The pressure to the top surface will be influence to the reliability of the LEDs. Precautions Should be taken to avoid the strong pressure on the encapsulated part. So when use the picking up nozzle,The pressure on the silicone resin should be proper.

8.1:Soldering iron :

8.1.1 When hand soldering, the temperature of the iron must less than 300℃ for 3 seconds.

8.1.2 The hand solder should be done only one times

8.2:SMT Reflow Soldering Instructions SMT:

8.2.1 Reflow soldering should not be done more than two times;

8.2.2 When soldering , do not put stress on the LEDs during heating;

8.2.3 The recommended reflow soldering profile as following:

3V 2016 20-30LM AC Led Chip Led Smd Bead Chips Bulb Light 2


8.3 Handling Precautions

8.3.1Handle the component along the side surface by using forceps or appropriate tools;

                                                                     3V 2016 20-30LM AC Led Chip Led Smd Bead Chips Bulb Light 3

8.3.2 Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry;

                        3V 2016 20-30LM AC Led Chip Led Smd Bead Chips Bulb Light 4


Contact Details

Phone Number : +8618897990409

WhatsApp : +8618897990409