1808 2700-6000K High Power Csp Led Chips 6-9LM

Basic Information
Place of Origin: SUZHOU
Brand Name: PHOENIX
Certification: LM80 ISO-9001 ROHS
Model Number: 1808
Minimum Order Quantity: 5000PCS
Price: Negotiation
Packaging Details: 4000PCS /ROLL
Delivery Time: 7-10 DAYS
Payment Terms: Western Union, MoneyGram, T/T
Supply Ability: 800KK PER MONTH
Name: SMD LED 1808 White Color Nput Voltage(V): 3v
Luminous Flux(lm): 6-9lm Cct: 2700K 3000K 6000K
Power: 0.06W Warranty(Year): 2 Years
Working Time (hours): 20000 Color Rendering Index(Ra): 80
Operating Temperature(℃): -40-85 Lamp Luminous Efficiency(lm/w): 140
High Light:

1808 csp led chips

,

2700 csp led chips

,

1808 high power led chips

3V 20MA 0.06W 1808 6-9LM 2700-6000K PPA SMD LED CHIP Used for home appliance display, automobile interior lighting 

 

The 1808 is one of the most mature LED packaging products in the automotive industry, which has been fully verified for its compact size and reliability. It is especially suitable for a variety of LED packaging standards. 1608 is available in many versions with different color and brightness levels.

True full-color natural light technology, using RGBW four-color light beads, can simulate 1 billion spectra and natural light at any time

Advantage:
Greatly reduce package size
Compared with TOPLED and mini TOPLED, the lumen output is consistent or even higher
Full color and brightness coverage
High flexibility for different designs (e.g. bar charts)
A package size suitable for various applications
characteristic:
Package: white SMT package
Typical radiation: 120 °
Corrosion resistance grade: 2B
Vehicle certification: aec-q102
ESD: 2 kV (HBM, level 2)
Dimensions: 1.6 x 0.8 x 0.6 mm
Apply:
Backlight of lamp group and key
Electronic equipment
Internal lighting (as shown in the environment diagram)
monitor

Package Structure:

1808 2700-6000K High Power Csp Led Chips 6-9LM 0

4.Absolute Maximum Ratings(Ta=25℃)

 

Parameter Symbol   Unit
Rating
Power Dissipation Pd 60 mW
Forward Current IF 20 mA
Peak Forward Current IFP 30 mA
Operating Temperature Topr -30~85
Storage Temperature Tstg -30~100
Junction temperature Tj 105
Electrostatic Discharge ESD 2000(HBM) V

 

5.Electrical and optical characteristics(Ta=25)

 

Parameter Symbol Test condition Min Typ Max Unit
Forward Voltage VF IF=20mA 2.7  - 3.3 V
Luminous Flux ф IF=20mA 6  - 9 LM
Color Temperature CCT IF=20mA 2500 -  6500 K
Reverse current VR VR=7V 0 μA
Color Rending Index Ra IF=20mA 90 - 
View Angle 2θ1/2 IF=20mA 120 deg

 

6.Typical Electro-Optical Characteristics Curves(Ta=25)

 

Parameter Symbol Test condition Min Typ Max Unit
Forward Voltage VF IF=20mA 2.7  - 3.3 V
Luminous Flux ф IF=20mA 6  - 9 LM
Color Temperature CCT IF=20mA 2500 -  6500 K
Reverse current VR VR=7V 0 μA
Color Rending Index Ra IF=20mA 90 - 
View Angle 2θ1/2 IF=20mA 120 deg

 

Typical Electro-Optical Characteristics Curves(Ta=25℃)

 

1808 2700-6000K High Power Csp Led Chips 6-9LM 1

Rank list

IV Rank:

Min Max Unit Condition
6 7 LM IF=20mA
7 8
8 9

VF Rank:

Min Max Unit Condition
2.7 2.8 V IF=20mA
2.8 2.9
2.9 3.0
3.0 3.1
3.1 3.2

 

Reliability Test

 

Test Item Test Conditions Standard Qty (Pcs)
Life Test 25℃,1000Hrs@150mA / 20
High Temperature 85℃,1000Hrs@150mA / 20
Low Temperature -40℃,1000Hrs@150mA / 20
High Humidity Heat

85℃,85%RH,

1000Hrs@150mA

/ 20
Low Temperature Storage -40℃,1000Hrs

JEITA ED-4701

200 202

20
High Temperature Storage 100℃,1000Hrs

JEITA ED-4701

200 201

20
Temperature Cycle (-40'C 30mins --25'C(5mins)--100'C(30mins) ,Temp changing rate:3+/-0.6'C/min)

JEITA ED-4701

100 105

20
Thermal Shock -40'C(15mins) --100'C(15mins),changing time <5mins ,300C MIL-STD-202G 20
Pulse Life Test Tp=1ms,DC=0.1,D=Tp/T @ 3×150mA / 20
ESD Test(HBM) 2000V,200V/Step, Forward & Reverse Test both 3times

AEC

(Q101-001)

20
Soldering Resistance

260±5℃,10S,3times

Pre-treatment 30℃,70%RH

JEITA ED-4701

300 302

20
Reflow IV Decay

260±5℃,10S,1time

Pre-treatment 30℃,70%RH,168Hrs

/ 20

 

Cautions:
The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the
Top of package. The pressure to the top surface will be influence to the reliability of the LEDs. Precautions Should be taken to avoid the strong pressure on the encapsulated part. So when use the picking up nozzle,The pressure on the silicone resin should be proper.

Soldering iron :
When hand soldering, the temperature of the iron must less than 300℃ for 3 seconds
The hand solder should be done only one times

SMT Reflow Soldering Instructions SMT :
Reflow soldering should not be done more than two times
When soldering , do not put stress on the LEDs during heating
The recommended reflow soldering profile as following

1808 2700-6000K High Power Csp Led Chips 6-9LM 2

Product features:

 

Adopt good quality chip and frame ,antistatic good stability Ultra low attenuation

High brightness ,low attenuation high color rendering

Minimum 70,80,90 95 CRI options

Strong welding and good stability undead light

Product series and company logo on the front

CE ROHS LM80 Certification

Product Process:

1808 2700-6000K High Power Csp Led Chips 6-9LM 3

 

 

 

 

 

Contact Details
admin

Phone Number : +8618897990409

WhatsApp : +8618897990409